Chip On Flex Market 2021 Size, Demand, Growth Prospects, Key Opportunities, Trends, Forecasts, Key Players and Industry Analysis

Global Chip on Flex Market, By Type (Single Sided Chip On Flex, Others), By Application (Static, Dynamic), By Verticals (Military, Medical, Aerospace, Electronics) — Forecast 2021

Chip on Flex Market Overview

The Global Chip on Flex Market is expected to grow from US ~$1437 Million in 2016 to US~$ 1795 Million by 2021, at an estimated CAGR of 4.43%.

Chip-on-flex denotes the semiconductor assembly technology wherein the flexible circuit is directly mounted with a microchip and connected electrically. This circuit is built on a flexible substrate instead of the conventional circuit board. 

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Shorter interconnection paths on chip on flex aid in simplifying the process of designing and manufacturing while improving the performance of the product. Chip on flex has some vital features such as penalization, shielding, component assembly, over molding, heat sinks and graphic overlay, making it acceptable across various sectors such as the electronic industry, aerospace, as well as, defense.

Significant growth in investments made in the research and development activities for the manufacture of advanced flexible displays is deemed to drive the chip-on-flex market substantially. Small flexible electronics can be used in various devices such as biomedical implants, displays, sensors, lighting, as well as radio frequency identification. In consequence to the wide array of uses, flexible electronics are encountering skyrocketed demand, hence, contributing significantly to the chip-on-flex market growth. Increased accuracy rate and reduced operational costs are some of the factors further attributing to the rapid growth in the chip on flex market. According to the latest report published by Market Research Future, the market is expected to garner a decent CAGR of 4.43% during the review period.

Market Segmentation

The chip-on-flex market has been segmented on the basis of types, application, and vertical. By type, the report provides detailed analysis on one sided chip on flex. Single sided chip-on-flex held 94% of the market share in 2016 and is expected to do the same throughout the review period. By application, the chip on flex market has been bifurcated into static and dynamic flexing. The segment of dynamic flexing is estimated to hold the largest chip-on-flex market share during the forecast period. On the basis of vertical, the market has been segmented into military, medical implants, aerospace, and electronics.

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Key Players

Some of the prominent players in the market of chip on flex market that are profiled by MRFR in their latest report include LGIT corporation (U.S.), Stemko group (Korea), Flexceed(Japan) , Chipbond technology corporation(Taiwan), CWE(Taiwan), Danbond technology Co. Ltd.(China), AKM Industrial Company Ltd.(China), Compass Technology Company Limited(Hong Kong), Compunetics(U.S.), and Stars Microelectronics Public Company Ltd. (Thailand).

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